Display device

ABSTRACT

A display device includes a substrate, a common electrode layer on the substrate where the common electrode layer includes a first common pad protruding in a second direction from a first reference side surface extending in a first direction and the second direction intersects the first direction, a driving layer between the substrate and the common electrode layer, a display layer between the driving layer and the common electrode layer, a first conductive via apart from the driving layer and between the substrate and the first common pad, and a driving chip at an opposite side of the first conductive via with reference to the driving layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2020-0046822, filed on Apr. 17, 2020, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND 1. Field

The present disclosure relates to a display device.

2. Brief Description of Related Developments

Examples of electronic paper include a twist ball display using asemi-spherical twist ball charged with static charges, anelectrophoretic display using electrophoresis and a micro-capsule, anin-plane type electrophoretic display, and a cholesterol display using acholesterol liquid crystal. An electrophoretic display having thehighest degree of commercialization uses an electrophoretic phenomenonthat charged particles are moved by an electric field applied in a statein which the charged particles are distributed in a dielectric fluid.

A representative electrophoretic display uses a micro-capsule chargedwith a dielectric fluid containing a plurality of types of inkcorpuscles having different electrification characteristics and colors.When such micro-capsules are mixed with a binder and located betweenupper and lower electrodes, and an electric field is applied to themicro-capsules, ink corpuscles charged according to the electric fieldapplied for each pixel are moved to the surface, thereby developingcolors.

The in-plane type electrophoretic display has a partition structurecalled Micro-Cup®. A micro-cup structure is formed by shaping aphotosensitive polymer layer by a roller having a patterned surface andthen curing the shaped photosensitive polymer layer by ultraviolet rays.Although a micro-cup structure may have various shapes as a top view,the micro-cup structure commonly has a hexagonal honeycomb structure.The in-plane type electrophoretic display is manufactured by sprayingand filling an electrophoretic dispersion solution in which severaltypes of charged pigment particles are dispersed in a dielectric fluidinto a micro-cup structure and sealing entrances of the micro-cups by asealing layer formed by a roller manner.

SUMMARY

A problem to be solved is to provide a display device having aminiaturized non-display area.

Another problem to be solved is to provide a display device including anadditional element.

However, the problems to be solved are not limited to the disclosure.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments of the disclosure.

According to one aspect of the disclosure, there is provided a displaydevice including: a substrate; a common electrode layer on thesubstrate, the common electrode layer including a first common padprotruding in a second direction from a first reference side surfaceextending in a first direction, the second direction intersecting withthe first direction; a driving layer between the substrate and thecommon electrode layer; a display layer between the driving layer andthe common electrode layer; a first conductive via apart from thedriving layer and between the substrate and the first common pad; and adriving chip at an opposite side of the first conductive via withreference to the driving layer.

The display device may further include a second conductive via apartfrom the first conductive via in the first direction, wherein the commonelectrode layer further includes a second common pad on the secondconductive via, and the second common pad protrudes from the firstreference side surface.

The first and second common pads may be respectively on both endportions of the first reference side surface arranged at opposite sidesin the first direction.

The display device may further include a protective layer on the commonelectrode layer, wherein the protective layer includes: a firstprotective pad on the first common pad; and a second protective pad onthe second common pad, the first and second protective pads protrudefrom a second reference side surface of the protective layer extendingin the first direction, and the protective layer, the first protectivepad, and the second protective pad include an electrical insulatingmaterial.

When viewing in a third direction orthogonal to an upper surface of thesubstrate, the first and second common pads may be inside the first andsecond protective pads, respectively.

The substrate may include: a first protruding substrate at the oppositeside of the first protective pad with reference to the first conductivevia; and a second protruding substrate at the opposite side of thesecond protective pad with reference to the second conductive via,wherein the first and second protruding substrates protrude from a thirdreference side surface of the substrate extending in the firstdirection.

The display device may further include a sealing membrane extending onthe substrate along an edge of the protective layer, an edge of thefirst protective pad, and an edge of the second protective pad.

A side surface of the sealing membrane may extend in the third directionorthogonal to the upper surface of the substrate.

When viewing in the third direction orthogonal to the upper surface ofthe substrate, a distance between the side surface of the sealingmembrane and the protective layer may be gradually less from the uppersurface of the substrate.

The sealing membrane may form a single layer with the protective layer,the first protective pad, and the second protective pad.

The display device may further include: a printed circuit board at anopposite side of the display layer with reference to the substrate; andan additional element on the printed circuit board, wherein theadditional element includes at least one of a light-emitting element andan antenna element, and when viewing in the third direction orthogonalto the upper surface of the substrate, the additional element is betweenthe first and second protective pads.

The substrate may include: a first protruding substrate between thefirst conductive via and the printed circuit board; and a secondprotruding substrate between the second conductive via and the printedcircuit board, wherein the first and second protruding substratesprotrude from the third reference side surface of the substrateextending in the first direction, and the additional element is exposedbetween the first and second protruding substrates.

The first common pad may be on any one of both end portions of the firstreference side surface arranged at opposite sides in the firstdirection.

The first common pad may be in a region between both end portions of thefirst reference side surface arranged at opposite sides in the firstdirection.

The display device may further include a housing, wherein the substrate,the driving layer, the display layer, the protective layer, the firstprotective pad, the second protective pad, the first conductive via, thesecond conductive via, and the driving chip are arranged in the housing,and the housing includes a first window overlapping the display layer inthe third direction orthogonal to the upper surface of the substrate.

The display device may further include: a printed circuit board at anopposite side of the display layer with reference to the substrate; anda light-emitting element on the printed circuit board, wherein theprinted circuit board and the light-emitting element are arranged in thehousing, and the housing further includes a second window overlappingthe light-emitting element in the third direction.

According to another aspect of the disclosure, there is provided adisplay device including: a substrate; an electronic paper layer on thesubstrate; and a driving chip configured to control the electronic paperlayer, wherein the driving chip and the electronic paper layer arearranged in a first direction parallel to an upper surface of thesubstrate, the electronic paper layer includes first and secondprotruding parts protruding from a reference side surface at an oppositeside of the driving chip, and the driving chip controls electrophoreticparticles inside the electronic paper layer by generating an electricfield inside the electronic paper layer.

The display device may further include: a first conductive via betweenthe first protruding part and the substrate; and a second conductive viabetween the second protruding part and the substrate, wherein the firstand second conductive vias apply a common voltage to the electronicpaper layer.

The display device may further include: a printed circuit board at anopposite side of the electronic paper layer with reference to thesubstrate; and an additional element on the printed circuit board,wherein the additional element includes at least one of a light-emittingelement and an antenna element, and when viewing in a second directionorthogonal to the upper surface of the substrate, the additional elementis between the first and second protruding parts.

The display device may further include a housing encompassing thesubstrate, the electronic paper layer, the driving chip, the printedcircuit board, and the additional element, wherein the electronic paperlayer includes a display area in which the electrophoretic particles areprovided and a non-display area around the display area, and the housingincludes a first window through which the display area of the electronicpaper layer is exposed and a second window overlapping the additionalelement in the second direction.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view of a display device according to an exampleembodiment of the disclosure;

FIG. 2 is a top view of the display device of FIG. 1;

FIG. 3 is a cross-sectional view taken along line A-A′ of FIG. 2;

FIG. 4 is a cross-sectional view taken along line B-B′ of FIG. 2;

FIG. 5 is a perspective view of a display device according to an exampleembodiment of the disclosure;

FIG. 6 is a top view of the display device of FIG. 5;

FIG. 7 is a cross-sectional view taken along line C-C′ of FIG. 6;

FIG. 8 is a perspective view of a display device according to an exampleembodiment of the disclosure;

FIG. 9 is a top view of the display device of FIG. 8;

FIG. 10 is a cross-sectional view taken along line D-D′ of FIG. 9;

FIG. 11 is a perspective view of a display device according to anexample embodiment of the disclosure;

FIG. 12 is a cross-sectional view taken along line E-E′ of FIG. 11;

FIG. 13 is a cross-sectional view taken along line F-F′ of FIG. 11;

FIG. 14 is a cross-sectional view taken along line E-E′ of FIG. 11 in adisplay device according to an example embodiment of the disclosure;

FIG. 15 is a cross-sectional view taken along line F-F′ of FIG. 11 inthe display device of FIG. 14;

FIG. 16 is a perspective view of a display device according to anexample embodiment of the disclosure;

FIG. 17 is a top view of the display device of FIG. 16;

FIG. 18 is a cross-sectional view taken along line G-G′ of FIG. 17;

FIG. 19 is a perspective view of a display device according to anexample embodiment of the disclosure;

FIG. 20 is a top view of the display device of FIG. 19;

FIG. 21 is a cross-sectional view taken along line H-H′ of FIG. 20;

FIG. 22 is a perspective view of a display device according to anexample embodiment of the disclosure;

FIG. 23 is a top view of the display device of FIG. 22;

FIG. 24 is a cross-sectional view taken along line I-I′ of FIG. 23;

FIG. 25 is a perspective view of a display device according to anexample embodiment of the disclosure; and

FIG. 26 is a top view of the display device of FIG. 25.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout. In this regard, the presentembodiments may have different forms and should not be construed asbeing limited to the descriptions set forth herein. Accordingly, theembodiments are merely described below, by referring to the figures, toexplain aspects of the present description. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items. Expressions such as “at least one of,” whenpreceding a list of elements, modify the entire list of elements and donot modify the individual elements of the list.

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings. Like referencenumerals in the drawings denote like elements, and in the drawings, thethicknesses or sizes of components may be exaggerated for convenienceand clarity of description. The embodiments described below are onlyillustrative, and various changes in form and details may be madetherein.

Hereinafter, when it is described that a certain component is “on anupper part of” or “on” another component, the certain component may bedirectly on another component, or a third component may be interposedtherebetween.

An expression in the singular includes an expression in the pluralunless they are clearly different from each other in context. Inaddition, when a component “includes” an element, unless there isanother opposite description thereto, it should be understood that thecomponent does not exclude another element but may further includeanother element.

FIG. 1 is a perspective view of a display device according to an exampleembodiment of the disclosure. FIG. 2 is a top view of the display deviceof FIG. 1. FIG. 3 is a cross-sectional view taken along line A-A′ ofFIG. 2. FIG. 4 is a cross-sectional view taken along line B-B′ of FIG.2.

Referring to FIGS. 1 to 4, a display device 1 may be provided. Thedisplay device 1 may include a substrate 100, a driving chip 10, adriving layer 200, a display layer 300, a common electrode layer 400, acommon pad 410, a conductive via 600, a lower pad 610, a protectivelayer 500, a protective pad 510, and a sealing membrane 700. The drivinglayer 200, the display layer 300, the common electrode layer 400, thecommon pad 410, the protective layer 500, and the protective pad 510 maybe referred to as an electronic paper layer. The substrate 100 mayinclude a transparent electrical insulating material. For example, thesubstrate 100 may include a glass substrate or a plastic substrate.

The driving chip 10 may be on the substrate 100. The driving chip 10 maybe electrically connected to the driving layer 200 and the commonelectrode layer 400. For example, the driving chip 10 may beelectrically connected to the driving layer 200 and the common electrodelayer 400 by wirings (not shown) on the substrate 100. The driving chip10 may control driving elements inside the driving layer 200 and apply acommon voltage to the common electrode layer 400.

The driving layer 200 may be on the substrate 100. The driving layer 200and the driving chip 10 may be arranged in a first direction DR1parallel to an upper surface 100 u of the substrate 100. For example,the driving layer 200 may be apart from the driving chip 10 in the firstdirection DR1. The driving layer 200 may include driving elements, firstconductive lines, and second conductive lines. The driving elements maydefine pixels, respectively. For example, the driving elements may bethin-film transistors. The driving elements may respectively have pixelelectrodes facing the display layer 300.

The first conductive lines may extend in the first direction DR1parallel to the upper surface 100 u of the substrate 100. The secondconductive lines may extend in a second direction DR2 parallel to theupper surface 100 u of the substrate 100 and intersecting with the firstdirection DR1. The driving elements may be respectively arranged inregions in which the first conductive lines intersect with the secondconductive lines. The first conductive lines and the second conductivelines may receive an electrical signal applied from the driving chip 10.A driving voltage may be applied to a pixel electrode of a drivingelement in a region in which a first conductive line and a secondconductive line to which the electrical signal is applied intersect witheach other.

The display layer 300 may be on the driving layer 200. The display layer300 may cover the driving layer 200. For example, a bonding layer may bebetween the display layer 300 and the driving layer 200. The displaylayer 300 may include electrophoretic particles having differentelectrical characteristics and colors. For example, some of theelectrophoretic particles may have positive charges and a black color,and the other some of the electrophoretic particles may have negativecharges and a white color. For example, the electrophoretic particleshaving positive charges and a black color may be carbon black particles,and the electrophoretic particles having negative charges and a whitecolor may be titanium oxide (TiO₂) or silica (SiO₂) particles. Theelectrophoretic particles may be provided to the inside of amicro-capsule or a partition structure together with a transparentdielectric fluid. The contents to be output by the display device 1 maydepend on locations of the electrophoretic particles. According to anembodiment of the disclosure, the electrophoretic particles may includewhite particles, black particles, and color particles. The whiteparticles and the black particles may be substantially the same as thosedescribed above. The color particles may have different colors from theblack and white colors. For example, the color particles may have a cyancolor, a magenta color, a yellow color, a red color, a green color, or ablue color. The color particles may be charged positively or negatively.For example, a net charge amount of the color particles may be less thana net charge amount of the white particles and a net charge amount ofthe black particles. The common electrode layer 400 may be on thedisplay layer 300. The common electrode layer 400 may face the drivinglayer 200 with the display layer 300 therebetween. The common electrodelayer 400 may include a transparent conductive material. For example,the common electrode layer 400 may include indium tin oxide (ITO). Thecommon voltage different from the driving voltage may be applied to thecommon electrode layer 400. An electric field may be formed between thecommon electrode layer 400 and a pixel electrode. Locations of theelectrophoretic particles may be controlled by an electric field betweenthe common electrode layer 400 and the pixel electrodes. In other words,the contents to be output by the display device 1 may be determined byan electric field between the common electrode layer 400 controlled bythe driving chip 10 and the pixel electrodes. Although it is shown thatthe common electrode layer 400 includes the display layer 300 whenviewing in a third direction DR3 orthogonal to the upper surface 100 uof the substrate 100, the present embodiment is not limited thereto.According to another embodiment of the disclosure, the common electrodelayer 400 may fully overlap the display layer 300 when viewing in thethird direction DR3.

The common pad 410 may be on a first reference side surface 400 s of thecommon electrode layer 400. The first reference side surface 400 s maybe a side surface of the common electrode layer 400 oriented in thefirst direction DR1. When viewing in the third direction DR3, a distancebetween the first reference side surface 400 s and the substrate 100 maybe approximately 5 mm to 7 mm. The common pad 410 may be on one endportion of the first reference side surface 400 s. The common pad 410may protrude from the first reference side surface 400 s. For example,the common pad 410 may extend on the first reference side surface 400 sin the first direction DR1. The common pad 410 may include anelectrically conductive material. For example, the common pad 410 mayinclude a metal (e.g., aluminum (Al) or copper (Cu)) or a transparentelectrode material (e.g., ITO). The common pad 410 may be electricallyconnected to the common electrode layer 400. For example, the common pad410 may be in direct contact with the common electrode layer 400. Forexample, the common pad 410 may form a single layer with the commonelectrode layer 400. In other words, the common pad 410 and the commonelectrode layer 400 may be connected to each other without a boundarysurface therebetween. For example, the common pad 410 and the commonelectrode layer 400 may be different layers. In other words, the commonpad 410 and the common electrode layer 400 may be connected to eachother with a boundary surface therebetween.

The lower pad 610 may be between the common pad 410 and the substrate100. For example, the lower pad 610 may be in direct contact with theupper surface 100 u of the substrate 100. The lower pad 610 may beelectrically connected to the driving chip 10 by a conductive wiringextending along the upper surface 100 u of the substrate 100. The lowerpad 610 may include an electrical material. For example, the lower pad610 may include Al or Cu.

The conductive via 600 may be between the lower pad 610 and the commonpad 410. The conductive via 600 may be electrically connected to thelower pad 610 and the common pad 410. For example, the conductive via600 may be in direct contact with the lower pad 610 and the common pad410. The conductive via 600 may apply the common voltage to the commonpad 410. For example, the conductive via 600 may include a silver paste.The common voltage may be applied to the common electrode layer 400 bythe common pad 410.

The protective layer 500 may be on the common electrode layer 400. Theprotective layer 500 may cover the common electrode layer 400. Theprotective layer 500 may protect layers under the protective layer 500so that the layers under the protective layer 500 are not damaged. Theprotective layer 500 may include a transparent electrical insulatingmaterial. For example, the protective layer 500 may include apolyethylene terephthalate (PET) film. For example, an antiglare filmmay be on an upper surface or under a lower surface of the protectivelayer 500. Although it is shown that the protective layer 500 includesthe common electrode layer 400 when viewing in the third direction DR3,the present embodiment is not limited thereto. According to anotherembodiment of the disclosure, the protective layer 500 may fully overlapthe common electrode layer 400 when viewing in the third direction DR3.

The protective pad 510 may be on the common pad 410. The protective pad510 may cover the common pad 410. The protective pad 510 may be on asecond reference side surface 500 s of the protective layer 500. Thesecond reference side surface 500 s may be a side surface of theprotective layer 500 oriented in the first direction DR1. The secondreference side surface 500 s may be a side surface of the protectivelayer 500 immediately adjacent to the first reference side surface 400s. The protective pad 510 may protrude from the second reference sidesurface 500 s. For example, the protective layer 500 may extend on thesecond reference side surface 500 s in the first direction DR1. Theprotective pad 510 may include an electrical insulating material. Forexample, the protective pad 510 may include a PET film. For example, theprotective pad 510 may form a single layer with the protective layer500. In other words, the protective pad 510 and the protective layer 500may be connected to each other without a boundary surface therebetween.For example, the protective pad 510 may be a different layer from theprotective layer 500. In other words, the protective pad 510 and theprotective layer 500 may be connected to each other with a boundarysurface therebetween. Although it is shown that the protective pad 510includes the common pad 410 when viewing in the third direction DR3, thepresent embodiment is not limited thereto. According to anotherembodiment of the disclosure, the protective pad 510 may fully overlapthe common pad 410 when viewing in the third direction DR3.

The sealing membrane 700 may be between the protective layer 500 and thesubstrate 100 and between the protective pad 510 and the substrate 100.The sealing membrane 700 may extend along an edge of the protectivelayer 500 and an edge of the protective pad 510. The sealing membrane700 may encompass the driving layer 200, the display layer 300, thecommon electrode layer 400, the common pad 410, the lower pad 610, andthe conductive via 600 so that the driving layer 200, the display layer300, the common electrode layer 400, the common pad 410, the lower pad610, and the conductive via 600 are not damaged. An outer side surface700 s of the sealing membrane 700 may be orthogonal to the upper surface100 u of the substrate 100. The outer side surface 700 s of the sealingmembrane 700 may extend in the third direction DR3. Although it is shownthat the outer side surface 700 s of the sealing membrane 700immediately adjacent to the second reference side surface 500 s forms acoplanar surface with the second reference side surface 500 s, thepresent embodiment is not limited thereto. According to anotherembodiment of the disclosure, the outer side surface 700 s of thesealing membrane 700 may be stepped from the second reference sidesurface 500 s, or the sealing membrane 700 may cover the secondreference side surface 500 s. The sealing membrane 700 may include anelectrical insulating material. For example, the sealing membrane 700may include silicon (Si) or a hot-melt epoxy adhesive.

An additional region R1 may be on the second reference side surface 500s. The additional region R1 may be between the sealing membrane 700immediately adjacent to the second reference side surface 500 s and thesealing membrane 700 under the protective pad 510. For example, anadditional element may be at an opposite side of the additional regionR1 with reference to the substrate 100. For example, the additionalelement may be at least one of a light-emitting element and an antennaelement. When the additional element is a light-emitting element, theadditional region R1 may be a region through which light generated bythe light-emitting element is emitted to the outside of the displaydevice 1. When the additional element is an antenna element, theadditional region R1 may be a region for a smooth radio transmission andreception operation between the antenna element and an external device.When the driving layer 200, the display layer 300, and the commonelectrode layer 400 are in the additional region R1, the driving layer200, the display layer 300, and the common electrode layer 400 mayabsorb light or disrupt communication.

Unlike the disclosure, when the common pad 410, the protective pad 510,the lower pad 610, and the conductive via 600 are adjacent to thedriving chip 10, the substrate 100 at a side of the driving chip 10 maybe demanded to have a wide area to arrange the common pad 410, theprotective pad 510, the lower pad 610, and the conductive via 600. Likethe disclosure, the additional region R1 may be separately demanded sothat the display device 1 has an additional element (e.g., alight-emitting element of an antenna element).

The common pad 410, the protective pad 510, the lower pad 610, theconductive via 600, and the additional region R1 of the disclosure maybe provided at an opposite side of the driving chip 10 to increase adegree of integration of the display device 1. A non-display area (i.e.,an area except for the display area 300 when viewing in the thirddirection DR3) of the display device 1 may have a small size.

FIG. 5 is a perspective view of a display device according to an exampleembodiment of the disclosure. FIG. 6 is a top view of the display deviceof FIG. 5. FIG. 7 is a cross-sectional view taken along line C-C′ ofFIG. 6. For conciseness of description, substantially the samedescription made with reference to FIGS. 1 to 4 may not be repeated.

Referring to FIGS. 5 to 7, a display device 2 may be provided. Thedisplay device 2 may include the substrate 100, the driving chip 10, thedriving layer 200, the display layer 300, the common electrode layer400, the common pad 410, the conductive via 600, the lower pad 610, theprotective layer 500, the protective pad 510, and the sealing membrane700.

Except for locations of the common pad 410, the protective pad 510, thelower pad 610, and the conductive via 600, the substrate 100, thedriving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, the common pad 410, the conductive via 600,the lower pad 610, the protective layer 500, the protective pad 510, andthe sealing membrane 700 may be substantially the same as thosedescribed with reference to FIGS. 1 to 4, respectively.

Unlike those described with reference to FIGS. 1 to 4, the common pad410 may be between both end portions of the first reference side surface400 s in the second direction DR2. For example, the common pad 410 maybe on a central part of the first reference side surface 400 s. Thelower pad 610 and the conductive via 600 may be under the common pad410.

The protective pad 510 may be between both end portions of the secondreference side surface 500 s in the second direction DR2. For example,the protective pad 510 may be on a central part of the second referenceside surface 500 s. The protective pad 510 may be on the common pad 410to cover the common pad 410.

A first additional region R2 a and a second additional region R2 b maybe separated from each other with the protective pad 510 therebetween.Each of the first additional region R2 a and the second additionalregion R2 b may be the same as the additional region R1 described withreference to FIGS. 1 to 4 except for a location thereof.

The common pad 410, the protective pad 510, the lower pad 610, theconductive via 600, the first additional region R2 a, and the secondadditional region R2 b of the disclosure may be at an opposite side ofthe driving chip 10 to increase a degree of integration of the displaydevice 2. The display device 2 may have a non-display area of a smallarea.

FIG. 8 is a perspective view of a display device according to an exampleembodiment of the disclosure. FIG. 9 is a top view of the display deviceof FIG. 8. FIG. 10 is a cross-sectional view taken along line D-D′ ofFIG. 9. For conciseness of description, substantially the samedescription made with reference to FIGS. 1 to 4 may not be repeated.

Referring to FIGS. 8 to 10, a display device 3 may be provided. Thedisplay device 3 may include the substrate 100, the driving chip 10, thedriving layer 200, the display layer 300, the common electrode layer400, a first common pad 412, a second common pad 414, a first conductivevia 602, a second conductive via 604, a first lower pad 612, a secondlower pad 614, the protective layer 500, a first protective pad 512, asecond protective pad 514, and the sealing membrane 700.

The substrate 100, the driving chip 10, the driving layer 200, thedisplay layer 300, the common electrode layer 400, and the protectivelayer 500 may be substantially the same as the substrate 100, thedriving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, and the protective layer 500 described withreference to FIGS. 1 to 4, respectively.

The first common pad 412 and the second common pad 414 may be on thefirst reference side surface 400 s. The first common pad 412 and thesecond common pad 414 may be separated from each other in the seconddirection DR2. The first common pad 412 and the second common pad 414may be on both end portions of the first reference side surface 400 s inthe second direction DR2, respectively. Each of the first common pad 412and the second common pad 414 may be substantially the same as thecommon pad 410 described with reference to FIGS. 1 to 4 except for alocation thereof.

The first lower pad 612 and the second lower pad 614 may be separatedfrom each other in the second direction DR2. The first lower pad 612 andthe second lower pad 614 may be under the first common pad 412 and thesecond common pad 414, respectively. Each of the first lower pad 612 andthe second lower pad 614 may be substantially the same as the lower pad610 described with reference to FIGS. 1 to 4 except for a locationthereof.

The first conductive via 602 and the second conductive via 604 may beseparated from each other in the second direction DR2. The firstconductive via 602 may be between the first common pad 412 and the firstlower pad 612. The second conductive via 604 may be between the secondcommon pad 414 and the second lower pad 614. Each of the firstconductive via 602 and the second conductive via 604 may besubstantially the same as the conductive via 600 described withreference to FIGS. 1 to 4 except for a location thereof.

The first protective pad 512 and the second protective pad 514 may be onthe second reference side surface 500 s. The first protective pad 512and the second protective pad 514 may be separated from each other inthe second direction DR2. For example, the first protective pad 512 andthe second protective pad 514 may be on both end portions of the secondreference side surface 500 s in the second direction DR2, respectively.The first protective pad 512 and the second protective pad 514 may be onthe first common pad 412 and the second common pad 414, respectively.Each of the first protective pad 512 and the second protective pad 514may be substantially the same as the protective pad 510 described withreference to FIGS. 1 to 4 except for a location thereof.

The sealing membrane 700 may extend on the substrate along an edge ofthe first protective pad 512, an edge of the second protective pad 514,and an edge of the protective layer 500. The sealing membrane 700 may besubstantially the same as the sealing membrane 700 described withreference to FIGS. 1 to 4 except for a shape thereof.

An additional region R3 may be between the first protective pad 512 andthe second protective pad 514. The additional region R3 may besubstantially the same as the additional region R1 described withreference to FIGS. 1 to 4 except for a location thereof.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, and the additional region R3 of the disclosure maybe at an opposite side of the driving chip 10 to increase a degree ofintegration of the display device 3. The display device 3 may have anon-display area of a small area.

FIG. 11 is a perspective view of a display device according to anexample embodiment of the disclosure. FIG. 12 is a cross-sectional viewtaken along line E-E′ of FIG. 11. FIG. 13 is a cross-sectional viewtaken along line F-F′ of FIG. 11. For conciseness of description,substantially the same description made with reference to FIGS. 1 to 4and 8 to 10 may not be repeated.

Referring to FIGS. 11 to 13, a display device 4 may be provided. Thedisplay device 4 may include the substrate 100, the driving chip 10, thedriving layer 200, the display layer 300, the common electrode layer400, the first common pad 412, the second common pad 414, the firstconductive via 602, the second conductive via 604, the first lower pad612, the second lower pad 614, the protective layer 500, the firstprotective pad 512, the second protective pad 514, and the sealingmembrane 700

The substrate 100, the driving chip 10, the driving layer 200, thedisplay layer 300, the common electrode layer 400, and the protectivelayer 500 may be substantially the same as the substrate 100, thedriving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, and the protective layer 500 described withreference to FIGS. 1 to 4, respectively. The first common pad 412, thesecond common pad 414, the first conductive via 602, the secondconductive via 604, the first lower pad 612, the second lower pad 614,the first protective pad 512, and the second protective pad 514 may besubstantially the same as the first common pad 412, the second commonpad 414, the first conductive via 602, the second conductive via 604,the first lower pad 612, the second lower pad 614, the first protectivepad 512, and the second protective pad 514 described with reference toFIGS. 8 to 10, respectively.

The outer side surface 700 s of the sealing membrane 700 may beinclined. The outer side surface 700 s of the sealing membrane 700 mayextend in a direction intersecting with the third direction DR3. Forexample, when viewing in the third direction DR3, the outer side surface700 s of the sealing membrane 700 may be closer to the driving layer200, the display layer 300, the common electrode layer 400, the firstcommon pad 412, the second common pad 414, the protective layer 500, thefirst protective pad 512, the second protective pad 514 as the outerside surface 700 s of the sealing membrane 700 is farther from the uppersurface 100 u of the substrate 100. For example, a length of thecircumference of the outer side surface 700 s of the sealing membrane700 may be gradually less from the upper surface 100 u of the substrate100. The circumference of the outer side surface 700 s of the sealingmembrane 700 may be a closed loop extending on the outer side surface700 s in a direction parallel to the upper surface 100 u of thesubstrate 100. Although it is shown that the outer side surface 700 s ofthe sealing membrane 700 is a curved surface, the present embodiment isnot limited thereto. The sealing membrane 700 may be substantially thesame as the sealing membrane 700 described with reference to FIGS. 1 to4 except for a shape of the outer side surface 700 s thereof.

An additional region R4 may be between the first protective pad 512 andthe second protective pad 514. The additional region R4 may besubstantially the same as the additional region R1 described withreference to FIGS. 1 to 4 except for a location thereof.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, and the additional region R4 of the disclosure maybe at an opposite side of the driving chip 10 to provide the displaydevice 4. The display device 4 may have a non-display area of a smallarea.

FIG. 14 is a cross-sectional view taken along line E-E′ of FIG. 11 in adisplay device according to an example embodiment of the disclosure.FIG. 15 is a cross-sectional view taken along line F-F′ of FIG. 11 inthe display device of FIG. 14. For conciseness of description,substantially the same description made with reference to FIGS. 1 to 4,8 to 10, and 11 to 13 may not be repeated.

Referring to FIGS. 14 and 15, a display device 5 may be provided. Thedisplay device 5 may include the substrate 100, the driving chip 10, thedriving layer 200, the display layer 300, the common electrode layer400, the first common pad 412, the second common pad 414, the firstconductive via 602, the second conductive via 604, the first lower pad612, the second lower pad 614, the protective layer 500, the firstprotective pad 512, the second protective pad 514, and a sealingmembrane 520.

The substrate 100, the driving chip 10, the driving layer 200, thedisplay layer 300, the common electrode layer 400, and the protectivelayer 500 may be substantially the same as the substrate 100, thedriving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, and the protective layer 500 described withreference to FIGS. 1 to 4, respectively. The first common pad 412, thesecond common pad 414, the first conductive via 602, the secondconductive via 604, the first lower pad 612, the second lower pad 614,the first protective pad 512, and the second protective pad 514 may besubstantially the same as the first common pad 412, the second commonpad 414, the first conductive via 602, the second conductive via 604,the first lower pad 612, the second lower pad 614, the first protectivepad 512, and the second protective pad 514 described with reference toFIGS. 8 to 10, respectively.

The sealing membrane 520 may form a single layer with the protectivelayer 500. In other words, the sealing membrane 520 and the protectivelayer 500 may be connected to each other without a boundary surfacetherebetween. The sealing membrane 520 may form a single layer with thefirst protective pad 512. In other words, the sealing membrane 520 andthe first protective pad 512 may be connected to each other without aboundary surface therebetween. The sealing membrane 520 may form asingle layer with the second protective pad 514. In other words, thesealing membrane 520 and the second protective pad 514 may be connectedto each other without a boundary surface therebetween. For example, thesealing membrane 520, the protective layer 500, the first protective pad512, and the second protective pad 514 may form a single layer. Thesealing membrane 520 may include the same material as the protective pad510 includes. For example, the sealing membrane 520 may include a PETfilm. An outer side surface 520 s of the sealing membrane 520 may beinclined as described with reference to FIGS. 11 to 13. The sealingmembrane 520 may be substantially the same as the sealing membrane 700described with reference to FIGS. 1 to 4 except for the abovedescription.

An additional region R5 may be between the first protective pad 512 andthe second protective pad 514. The additional region R5 may besubstantially the same as the additional region R1 described withreference to FIGS. 1 to 4 except for a location thereof.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, and the additional region R5 of the disclosure maybe at an opposite side of the driving chip 10 to provide the displaydevice 5. The display device 5 may have a non-display area of a smallarea.

FIG. 16 is a perspective view of a display device according to anexample embodiment of the disclosure. FIG. 17 is a top view of thedisplay device of FIG. 16. FIG. 18 is a cross-sectional view taken alongline G-G′ of FIG. 17. For conciseness of description, substantially thesame description made with reference to FIGS. 1 to 4 and 8 to 10 may notbe repeated.

Referring to FIGS. 16 to 18, a display device 6 may be provided. Thedisplay device 6 may include the substrate 100, a first protrudingsubstrate 122, a second protruding substrate 124, the driving chip 10,the driving layer 200, the display layer 300, the common electrode layer400, the first common pad 412, the second common pad 414, the firstconductive via 602, the second conductive via 604, the first lower pad612, the second lower pad 614, the protective layer 500, the firstprotective pad 512, the second protective pad 514, and the sealingmembrane 700.

The substrate 100, the driving chip 10, the driving layer 200, thedisplay layer 300, the common electrode layer 400, and the protectivelayer 500 may be substantially the same as the substrate 100, thedriving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, and the protective layer 500 described withreference to FIGS. 1 to 4, respectively. The first common pad 412, thesecond common pad 414, the first conductive via 602, the secondconductive via 604, the first lower pad 612, the second lower pad 614,the first protective pad 512, the second protective pad 514, and thesealing membrane 700 may be substantially the same as the first commonpad 412, the second common pad 414, the first conductive via 602, thesecond conductive via 604, the first lower pad 612, the second lower pad614, the first protective pad 512, the second protective pad 514, andthe sealing membrane 700 described with reference to FIGS. 8 to 10,respectively.

The first protruding substrate 122 and the second protruding substrate124 may be on a third reference side surface 100 s. The third referenceside surface 100 s may be a side surface of the substrate 100 orientedin the first direction DR1. The first protruding substrate 122 and thesecond protruding substrate 124 may be on both end portions of the thirdreference side surface 100 s in the second direction DR2. The firstprotruding substrate 122 and the second protruding substrate 124 mayprotrude from the third reference side surface 100 s. For example, thefirst protruding substrate 122 and the second protruding substrate 124may extend on the third reference side surface 100 s in the firstdirection DR1. The first protruding substrate 122 and the secondprotruding substrate 124 may include a transparent electrical insulatingmaterial. For example, the first protruding substrate 122 and the secondprotruding substrate 124 may include glass. For example, the firstprotruding substrate 122 and the second protruding substrate 124 mayform a single layer with the substrate 100. In other words, each of thefirst protruding substrate 122 and the second protruding substrate 124and the substrate 100 may be connected to each other without a boundarysurface therebetween. For example, the first protruding substrate 122and the second protruding substrate 124 may be separated from thesubstrate 100. In other words, each of the first protruding substrate122 and the second protruding substrate 124 and the substrate 100 may beconnected to each other with a boundary surface therebetween.

The first lower pad 612, the first conductive via 602, the first commonpad 412, and the first protective pad 512 may be sequentially on thefirst protruding substrate 122. The second lower pad 614, the secondconductive via 604, the second common pad 414, and the second protectivepad 514 may be sequentially on the second protruding substrate 124. Thesealing membrane 700 may be between the first protruding substrate 122and the first protective pad 512 and between the second protrudingsubstrate 124 and the second protective pad 514.

An upper additional region R6 may be between the first protective pad512 and the second protective pad 514. A lower additional region R7 maybe between the first protruding substrate 122 and the second protrudingsubstrate 124. Unlike the description made with reference to FIGS. 1 to4, an additional element may be under the lower additional region R7.When the additional element is a light-emitting element, the upperadditional region R6 and the lower additional region R7 may be regionsthrough which light generated by the light-emitting element is emittedto the outside of the display device 6. When the additional element isan antenna element, the upper additional region R6 and the loweradditional region R7 may be regions for a smooth radio transmission andreception operation between the antenna element and an external device.

Although it is shown that the sealing membrane 700 immediately adjacentto the third reference side surface 100 s is stepped from the thirdreference side surface 100 s, the present embodiment is not limitedthereto. According to another embodiment of the disclosure, the thirdreference side surface 100 s may form a coplanar surface with thesealing membrane 700. Although it is shown that the first protective pad512 and the second protective pad 514 are respectively inside the firstprotruding substrate 122 and the second protruding substrate 124 whenviewing in the third direction DR3, the present embodiment is notlimited thereto. According to another embodiment of the disclosure, thefirst protective pad 512 and the second protective pad 514 may fullyoverlap the first protruding substrate 122 and the second protrudingsubstrate 124, respectively.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, the upper additional region R6, and the loweradditional region R7 of the disclosure may be at an opposite side of thedriving chip 10. The display device 6 may have a non-display area of asmall area.

FIG. 19 is a perspective view of a display device according to anexample embodiment of the disclosure. FIG. 20 is a top view of thedisplay device of FIG. 19. FIG. 21 is a cross-sectional view taken alongline H-H′ of FIG. 20. For conciseness of description, substantially thesame description made with reference to FIGS. 1 to 4 and 8 to 10 may notbe repeated.

Referring to FIGS. 19 to 21, a display device 1100 may be provided. Thedisplay device 1100 may include the substrate 100, the driving chip 10,the driving layer 200, the display layer 300, the common electrode layer400, the first common pad 412, the second common pad 414, the firstconductive via 602, the second conductive via 604, the first lower pad612, the second lower pad 614, the protective layer 500, the firstprotective pad 512, the second protective pad 514, the sealing membrane700, a printed circuit board 20, a connector 40, and a light-emittingelement 30. The substrate 100, the driving chip 10, the driving layer200, the display layer 300, the common electrode layer 400, and theprotective layer 500 may be substantially the same as the substrate 100,the driving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, and the protective layer 500 described withreference to FIGS. 1 to 4, respectively. The first common pad 412, thesecond common pad 414, the first conductive via 602, the secondconductive via 604, the first lower pad 612, the second lower pad 614,the first protective pad 512, the second protective pad 514, and thesealing membrane 700 may be substantially the same as the first commonpad 412, the second common pad 414, the first conductive via 602, thesecond conductive via 604, the first lower pad 612, the second lower pad614, the first protective pad 512, the second protective pad 514, andthe sealing membrane 700 described with reference to FIGS. 8 to 10,respectively.

The printed circuit board 20 may be at an opposite side of an electronicpaper layer with reference to the substrate 100. The printed circuitboard 20 may include certain elements configured to control the displaydevice 1100. For example, the printed circuit board 20 may include acontrol element configured to generate a command signal to be providedto the driving chip 10, a storage element, a communication element, andan input element to which a user of the display device 1100 inputs asignal. The printed circuit board 20 may be electrically connected tothe driving chip 10 by the connector 40.

The light-emitting element 30 may be provided to the printed circuitboard 20. For example, the light-emitting element 30 may be insertedinto the printed circuit board 20 and pass through the printed circuitboard 20. The light-emitting element 30 may overlap an additional regionR8 in the third direction DR3. Light emitted from the light-emittingelement 30 may sequentially pass through the substrate 100 and theadditional region R8. For example, the light-emitting element 30 mayinclude a light-emitting diode (LED). According to another embodiment ofthe disclosure, an antenna element may be provided to the printedcircuit board 20 instead of or together with the light-emitting element30.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, and the additional region R8 of the disclosure maybe at an opposite side of the driving chip 10. The display device 1100may have a non-display area of a small area.

FIG. 22 is a perspective view of a display device according to anexample embodiment of the disclosure. FIG. 23 is a top view of thedisplay device of FIG. 22. FIG. 24 is a cross-sectional view taken alongline I-I′ of FIG. 23. For conciseness of description, substantially thesame description made with reference to FIGS. 1 to 4, 8 to 10, and 16 to18 may not be repeated.

Referring to FIGS. 22 to 24, a display device 1200 may be provided. Thedisplay device 1200 may include the substrate 100, the first protrudingsubstrate 122, the second protruding substrate 124, the driving chip 10,the driving layer 200, the display layer 300, the common electrode layer400, the first common pad 412, the second common pad 414, the firstconductive via 602, the second conductive via 604, the first lower pad612, the second lower pad 614, the protective layer 500, the firstprotective pad 512, the second protective pad 514, the sealing membrane700, the printed circuit board 20, the connector 40, and thelight-emitting element 30.

The substrate 100, the driving chip 10, the driving layer 200, thedisplay layer 300, the common electrode layer 400, and the protectivelayer 500 may be substantially the same as the substrate 100, thedriving chip 10, the driving layer 200, the display layer 300, thecommon electrode layer 400, and the protective layer 500 described withreference to FIGS. 1 to 4, respectively. The first common pad 412, thesecond common pad 414, the first conductive via 602, the secondconductive via 604, the first lower pad 612, the second lower pad 614,the first protective pad 512, the second protective pad 514, and thesealing membrane 700 may be substantially the same as the first commonpad 412, the second common pad 414, the first conductive via 602, thesecond conductive via 604, the first lower pad 612, the second lower pad614, the first protective pad 512, the second protective pad 514, andthe sealing membrane 700 described with reference to FIGS. 8 to 10,respectively. The first protruding substrate 122 and the secondprotruding substrate 124 may be substantially the same as the firstprotruding substrate 122 and the second protruding substrate 124described with reference to FIGS. 16 to 18, respectively.

The printed circuit board 20 may be at an opposite side of an electronicpaper layer with reference to the substrate 100. The printed circuitboard 20 may include certain elements configured to control the displaydevice 1200. For example, the printed circuit board 20 may include acontrol element configured to generate a command signal to be providedto the driving chip 10, a storage element, a communication element, andan input element to which a user of the display device 1200 inputs asignal. The printed circuit board 20 may be electrically connected tothe driving chip 10 by the connector 40.

The light-emitting element 30 may be provided to the printed circuitboard 20. For example, the light-emitting element 30 may be insertedinto the printed circuit board 20 and pass through the printed circuitboard 20. The light-emitting element 30 may overlap an upper additionalregion R9 and a lower additional region R10 in the third direction DR3.The light-emitting element 30 may be exposed by the lower additionalregion R10 Light emitted from the light-emitting element 30 maysequentially pass through the lower additional region R10 and the upperadditional region R9. For example, the light-emitting element 30 mayinclude an LED. According to another embodiment of the disclosure, anantenna element may be provided to the printed circuit board 20 insteadof or together with the light-emitting element 30.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, and the additional region R9 of the disclosure maybe at an opposite side of the driving chip 10. The display device 1200may have a non-display area of a small area.

FIG. 25 is a perspective view of a display device according to anexample embodiment of the disclosure. FIG. 26 is a top view of thedisplay device of FIG. 25. For conciseness of description, substantiallythe same description made with reference to FIGS. 19 to 21 and 22 to 24may not be repeated.

Referring to FIGS. 25 and 26, a display device 2000 including a housing2100, a first window 2200, a second window 2300, and an input region2400 may be provided. The housing 2100 may encompass the display device1100 described with reference to FIGS. 19 to 21 or the display device1200 described with reference to FIGS. 22 to 24.

The first window 2200 may be on a light-emitting element. The firstwindow 2200 may receive light generated by the light-emitting elementand emit the light to the outside of the display device 2000. The firstwindow 2200 may include a transparent material or a translucent materialor have an opening.

The second window 2300 may be on the display layer 300. A user of thedisplay device 2000 may view the contents displayed on the display layer300, through the second window 2300. The second window 2300 may includea transparent material or have an opening. Although it is shown that thesecond window 2300 is included in the display layer 300 when viewing ina direction in which the second window 2300 faces the display layer 300,the present embodiment is not limited thereto. As another example, thesecond window 2300 may fully overlap the display layer 300 when viewingin the direction in which the second window 2300 faces the display layer300.

The first common pad 412, the first protective pad 512, the first lowerpad 612, the first conductive via 602, the second common pad 414, thesecond protective pad 514, the second lower pad 614, the secondconductive via 604, and an additional region of the disclosure may be atan opposite side of a driving chip. The display device 2000 may have anon-display area of a small area.

The disclosure may provide a display device including a minimizednon-display area.

The disclosure may provide a display device including an additionalelement.

However, the effects of the disclosure are not limited to those effectsdescribed herein.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments. While one or more embodiments have beendescribed with reference to the figures, it will be understood by thoseof ordinary skill in the art that various changes in form and detailsmay be made therein without departing from the spirit and scope of thedisclosure as defined by the following claims.

What is claimed is:
 1. A display device comprising: a substrate; acommon electrode layer on the substrate, the common electrode layercomprising a first common pad protruding in a second direction from afirst reference side surface extending in a first direction, the seconddirection intersecting the first direction; a driving layer between thesubstrate and the common electrode layer; a display layer between thedriving layer and the common electrode layer; a first conductive viaapart from the driving layer and between the substrate and the firstcommon pad; and a driving chip at an opposite side of the firstconductive via with reference to the driving layer.
 2. The displaydevice of claim 1, further comprising a second conductive via apart fromthe first conductive via in the first direction, wherein the commonelectrode layer further comprises a second common pad on the secondconductive via, and the second common pad protrudes from the firstreference side surface.
 3. The display device of claim 2, wherein thefirst and second common pads are respectively on both end portions ofthe first reference side surface arranged at opposite sides in the firstdirection.
 4. The display device of claim 3, further comprising aprotective layer on the common electrode layer, wherein the protectivelayer comprises: a first protective pad on the first common pad; and asecond protective pad on the second common pad, the first and secondprotective pads protrude from a second reference side surface of theprotective layer extending in the first direction, and the protectivelayer, the first protective pad, and the second protective pad includean electrical insulating material.
 5. The display device of claim 4,wherein, when viewing in a third direction orthogonal to an uppersurface of the substrate, the first and second common pads are insidethe first and second protective pads, respectively.
 6. The displaydevice of claim 4, wherein the substrate comprises: a first protrudingsubstrate at the opposite side of the first protective pad withreference to the first conductive via; and a second protruding substrateat the opposite side of the second protective pad with reference to thesecond conductive via, wherein the first and second protrudingsubstrates protrude from a third reference side surface of the substrateextending in the first direction.
 7. The display device of claim 6,further comprising a sealing membrane extending on the substrate alongan edge of the protective layer, an edge of the first protective pad,and an edge of the second protective pad.
 8. The display device of claim7, wherein a side surface of the sealing membrane extends in a thirddirection orthogonal to an upper surface of the substrate.
 9. Thedisplay device of claim 7, wherein, when viewing in a third directionorthogonal to an upper surface of the substrate, a distance between theside surface of the sealing membrane and the protective layer isgradually less from the upper surface of the substrate.
 10. The displaydevice of claim 7, wherein the sealing membrane forms a single layerwith the protective layer, the first protective pad, and the secondprotective pad.
 11. The display device of claim 4, further comprising: aprinted circuit board at an opposite side of the display layer withreference to the substrate; and an additional element on the printedcircuit board, wherein the additional element comprises at least one ofa light-emitting element and an antenna element, and when viewing in athird direction orthogonal to an upper surface of the substrate, theadditional element is between the first and second protective pads. 12.The display device of claim 11, wherein the substrate comprises: a firstprotruding substrate between the first conductive via and the printedcircuit board; and a second protruding substrate between the secondconductive via and the printed circuit board, wherein the first andsecond protruding substrates protrude from a third reference sidesurface of the substrate extending in the first direction, and theadditional element is exposed between the first and second protrudingsubstrates.
 13. The display device of claim 1, wherein the first commonpad is on any one of both end portions of the first reference sidesurface arranged at opposite sides in the first direction.
 14. Thedisplay device of claim 1, wherein the first common pad is in a regionbetween both end portions of the first reference side surface arrangedat opposite sides in the first direction.
 15. The display device ofclaim 4, further comprising: a housing, wherein the substrate, thedriving layer, the display layer, the protective layer, the firstprotective pad, the second protective pad, the first conductive via, thesecond conductive via, and the driving chip are arranged in the housing,and the housing comprises a first window overlapping the display layerin a third direction orthogonal to an upper surface of the substrate.16. The display device of claim 15, further comprising: a printedcircuit board at an opposite side of the display layer with reference tothe substrate; and a light-emitting element on the printed circuitboard, wherein the printed circuit board and the light-emitting elementare arranged in the housing, and the housing further comprises a secondwindow overlapping the light-emitting element in the third direction.17. A display device comprising: a substrate; an electronic paper layeron the substrate; and a driving chip configured to control theelectronic paper layer, wherein the driving chip and the electronicpaper layer are arranged in a first direction parallel to an uppersurface of the substrate, the electronic paper layer comprises first andsecond protruding parts protruding from a reference side surface at anopposite side of the driving chip, and the driving chip controlselectrophoretic particles inside the electronic paper layer bygenerating an electric field inside the electronic paper layer.
 18. Thedisplay device of claim 17, further comprising: a first conductive viabetween the first protruding part and the substrate; and a secondconductive via between the second protruding part and the substrate,wherein the first and second conductive vias apply a common voltage tothe electronic paper layer.
 19. The display device of claim 18, furthercomprising: a printed circuit board at an opposite side of theelectronic paper layer with reference to the substrate; and anadditional element on the printed circuit board, wherein the additionalelement comprises at least one of a light-emitting element and anantenna element, and when viewing in a second direction orthogonal tothe upper surface of the substrate, the additional element is betweenthe first and second protruding parts.
 20. The display device of claim19, further comprising a housing encompassing the substrate, theelectronic paper layer, the driving chip, the printed circuit board, andthe additional element, wherein the electronic paper layer comprises: adisplay area in which the electrophoretic particles are provided; and anon-display area around the display area, and the housing comprises: afirst window through which the display area of the electronic paperlayer is exposed; and a second window overlapping the additional elementin the second direction.